Call details:

Sectoral Digital Skills Academies - Semiconductors (Chips Skills Academy)

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Objective of the call

The objective of this action is to establish a Sectoral Digital Skills Academy in Semiconductors (Chips Skills Academy) to strengthen Europe’s technological sovereignty and address critical workforce shortages in the semiconductor value chain.

The academy will complement existing EU actions, including the EU Chips Act and previous DIGITAL and Erasmus+ initiatives, and respond to the growing demand for semiconductor professionals, estimated at over 200,000 additional workers by 2030.

The Chips Skills Academy will identify skills gaps, develop new education and training offers, scale up successful programmes, and create a strong sectoral ecosystem to increase the number of specialists in microelectronics, photonics, chips manufacturing and packaging.

Scope of activities

The academy will operate across three main pillars:

  1. Knowledge, education and training

• Develop and implement academic curricula at Bachelor’s and/or Master’s level in microelectronics, photonics, semiconductor manufacturing and packaging.
• Design modular short-term training programmes for current workers addressing industry-specific needs.
• Pilot training delivery at regional or local level.
• Develop training programmes for teaching staff (“train-the-trainer” modules).
• Promote mobility of industry professionals into teaching roles.
• Align programmes with ECTS, the European Approach to Microcredentials and relevant EU frameworks.
• Scale up and disseminate successful EU-funded higher education and training programmes.

  1. Building the ecosystem

• Establish partnerships between academia, research organisations, industry (including SMEs), public authorities and industrial associations.
• Promote semiconductor career pathways and increase visibility of opportunities.
• Support participation of women, young talents from disadvantaged backgrounds and people with disabilities.
• Collaborate with ELEVATE (European League of Advanced Digital Skills Academies), other SO4-funded projects and relevant EU initiatives such as Erasmus+ Alliances, Centres of Vocational Excellence and Large-Scale Partnerships under the Pact for Skills.
• Manage a dedicated landing page within the Digital Skills and Jobs Platform to disseminate activities and opportunities.

  1. Measuring progress

• Develop a methodology to monitor labour market evolution and semiconductor skills gaps.
• Define and monitor key performance indicators aligned with EU frameworks such as the Digital Decade targets and the Common European Data Space for Skills.
• Provide policy and investment recommendations based on impact assessment.

Deliverables

• Comprehensive academic curricula implemented at European level.
• Modular short-term training curricula piloted at regional or local level.
• Established partnerships and collaboration frameworks between academia and industry.
• Support and visibility schemes promoting inclusive participation.
• Training initiatives for teaching staff.
• Communication and awareness-raising activities.
• Dedicated landing page within the Digital Skills and Jobs Platform.
• Impact reports and policy recommendations.

Eligible applicants

  • higher education institutions
  • vocational education and training(VET) institutions
  • research organisations
  • businesses
  • national and regional governments
  • social partners
  • industrial associations
  • education service providers
  • other relevant related organisations
  • Organisations based in EU Member States, EFTA/EEA, or Associated Countries (more info on eligible countries will be published soon)

Funding conditions

Type of action: 
Lump sum grant 

Funding rate: 
50%

Indicative budget 
€10 million 

Indicative duration of the action 
24-48 months

Deadline for submission

Q2 2027

Forthcoming
Company size: VET institutions, Research, SMEs, Enterprises, Public authorities
Issuer: European Health and Digital Executive Agency
Area: Digital
Call type: Lump sum grant
Co-funding: 50%
Date published: Q1 2027
Deadline for submission: Q2 2027

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